One Stop OEM PCB le PCBA Electtronic service production
Tšebeletso ea Rōna
● Litšebeletso tsa Rōna: Litšebeletso tsa tlhahiso ea elektronike tsa PCB le PCBA
● Tšebeletso ea tlhahiso ea PCB: Hloka faele ea Gerber(CAM350 RS274X), lifaele tsa PCB (Protel 99, AD, Eagle), joalo-joalo.
● Litšebeletso tsa ho fumana likarolo: Lethathamo la BOM le kenyelelitse nomoro ea Karolo e qaqileng le Moqapi
● Litšebeletso tsa kopano ea PCB: Lifaele tse ka holimo le Lifaele tsa Khetha le ho Beha, setšoantšo sa kopano
● Litšebeletso tsa Mananeo le Liteko: Lenaneo, tataiso le mokhoa oa teko joalo-joalo.
● Litšebeletso tsa kopano ea matlo: Lifaele tsa 3D, mohato kapa tse ling
● Litšebeletso tsa boenjiniere ba morao: Mehlala le tse ling
● Litšebeletso tsa ho kopanya lithapo le lithapo: Lintlha le tse ling
● Litšebeletso tse ling: Litšebeletso tse ekelitsoeng ka boleng
Bokhoni ba tekheniki ba PCB
| Mekhahlelo | Tlhahiso e kholo: 2 ~ 58 layers / Pilot run: 64 layers |
| Max. Botenya | Tlhahiso e kholo: 394mil (10mm) / Pilot run: 17.5mm |
| Lintho tse bonahalang | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic e tlatsitsoeng, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, joalo-joalo. |
| Min. Bophara/ Sebaka | Lera le ka hare: 3mil/3mil (HOZ), Lera ka ntle: 4mil/4mil(1OZ) |
| Max. Botenya ba Koporo | Setifikeiti sa UL: 6.0 OZ / Pilot run: 12OZ |
| Min. Boholo ba lesoba | Boro ea mochini: 8mil(0.2mm) Laser ea cheka: 3mil(0.075mm) |
| Max. Boholo ba Panel | 1150mm × 560mm |
| Aspect ratio | 18:1 |
| Surface Finish | HASL,Khauta e qoelisoang, Tin ea ho qoelisoa, OSP, ENIG + OSP, Silivera e qoelisoang, ENEPIG, Monoana oa Khauta |
| Mokhoa o Khethehileng | Lesoba le Epetsoeng, Lesoba le Foufetseng, Khanyetso e Kenyelelitsoeng, Bokhoni bo Kenyellelitsoeng, Hybrid, Lebasetere la Karolo, Sekhahla se phahameng sa sekhahla, Ho cheka ka morao, le Resistance control |
Bokhoni ba tekheniki ba PCB
| SMT | Ho nepahala ha boemo:20 um |
| Boholo ba likarolo: 0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. karolo bophahamo::25mm | |
| Max. PCB boholo: 680×500mm | |
| Min. PCB boholo: ha ho na moeli | |
| Botenya ba PCB: 0.3 ho 6mm | |
| Boima ba PCB: 3KG | |
| Leqhubu-Solder | Max. PCB bophara: 450mm |
| Min. PCB bophara: ha ho na moeli | |
| Bophahamo ba karolo: Top 120mm/Bot 15mm | |
| Mofufutso-Solder | Mofuta oa tšepe: karolo, kaofela, inlay, sidestep |
| Lintho tse entsoeng ka tšepe: Koporo, Aluminium | |
| Qetello ea Bokaholimo: Plating Au, plating sliver, plating Sn | |
| Sekhahla sa senya sa moea: ka tlase ho 20% | |
| Tobetsa-lokela | Sebaka sa khatiso: 0-50KN |
| Max. PCB boholo: 800X600mm | |
| Teko | ICT, Probe flying, cha-in, teko ea mosebetsi, ho palama baesekele |
