Khomphuta le Peripherals PCBA boto

Tšebeletso ea rona:

Li-platform tsa komporo li tsoela pele ho hola mabapi le lebelo, bokhoni le polokelo / phapanyetsano ea tlhahisoleseling.Tlhokahalo ea komporo ea leru, data e kholo, mecha ea litaba ea sechaba, boithabiso le lits'ebetso tsa mehala e ntse e hola le ho khanna tlhoko ea tlhaiso-leseling e batsi ka nako e khuts'oane.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Sebopeho sa lihlahisoa

● -Material: Fr-4

● -Palo ea Layer: 14 layers

● -PCB Botenya: 1.6mm

● -Min.Trace / Space Outer: 4/4mil

● -Min.Sekoti se phuntsoeng: 0.25mm

● -Ka Mokhoa: Ho Tenta ka Vias

● -Qetellong ea Bokaholimo: ENIG

Litšobotsi tsa sebopeho sa PCB

1. Solderresistant inki (Solderresistant/SolderMask): Ha se libaka tsohle tsa koporo tse lokelang ho ja likaroloana tsa thini, kahoo sebaka se sa jeoang se tla hatisoa ka lera la thepa (hangata epoxy resin) e arolang bokaholimo ba koporo ho tloha ho jeleng thini ho ea ho. qoba ho se solder.Ho na le potoloho e khuts'oane lipakeng tsa mela e entsoeng ka makotikoti.Ho ea ka mekhoa e fapaneng, e arotsoe ka oli e tala, oli e khubelu le oli e putsoa.

2. Dielectric layer (Dielectric): E sebelisetsoa ho boloka ho pata pakeng tsa mela le lihlopha, tse tsejoang e le substrate.

3. Phekolo ea holim'a metsi (SurtaceFinish): Kaha bokaholimo ba koporo bo na le oxidized habonolo tikolohong e akaretsang, e ke ke ea koaheloa ka makotikoti (mafutsana a solderability), kahoo bokaholimo ba koporo bo tla sireletsoa.Mekhoa ea ts'ireletso e kenyelletsa HASL, ENIG, Immersion Silver, Immersion TIn, le organic solder preservative (OSP).Mokhoa o mong le o mong o na le melemo le mefokolo ea oona, ka kakaretso o bitsoa phekolo ea holim'a metsi.

SFSdvd (1)
SFSdvd (2)

Bokhoni ba Boenjiniere ba PCB

Mekhahlelo Tlhahiso e kholo: 2 ~ 58 layers / Pilot run: 64 layers
Max.Botenya Tlhahiso e kholo: 394mil (10mm) / Pilot run: 17.5mm
Lintho tse bonahalang FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic e tlatsitsoeng, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, joalo-joalo.
Min.Bophara/ Sebaka Lera le ka hare: 3mil/3mil (HOZ), Lera ka ntle: 4mil/4mil(1OZ)
Max.Botenya ba Koporo Setifikeiti sa UL: 6.0 OZ / Pilot run: 12OZ
Min.Boholo ba lesoba Boro ea mochini: 8mil(0.2mm) Laser ea cheka: 3mil(0.075mm)
Max.Boholo ba Panel 1150mm × 560mm
Aspect ratio 18:1
Surface Finish HASL,Khauta e qoelisoang, Tin ea ho qoelisoa, OSP, ENIG + OSP, Silivera e qoelisoang, ENEPIG, Monoana oa Khauta
Mokhoa o Khethehileng Lesoba le Epetsoeng, Sekoti se Foufetseng, Khanyetso e Kenyelelitsoeng, Bokhoni bo Kenyelelitsoeng, Hybrid, Lebasetere la Karolo, Boima bo phahameng bo sa Lekaneng, Ho cheka ka morao, le Resistance control.

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona