Puisano sesebelisoa PCBA boto

Tšebeletso ea rona:

Ka tsoelo-pele e kopanetsoeng ea thekenoloji ea 4G le ho phahama ka potlako ha thekenoloji ea 5G, indasteri ea puisano e hōlile ka tekanyo e phahameng, 'me e tsamaisitse keketseho e tsoelang pele ea tlhokahalo ea litšebeletso tsa thekenoloji ea marang-rang, ho tlisa monyetla o mocha oa nts'etsopele ea thekenoloji ea puisano ea puisano. ditshebeletso.Ka botumo ba boleng bo phahameng, ho tšepahala le botsitso, Suntak Technology e fetohile mofani oa lihlopha tse kholo tsa puisano Chaena esita le lefats'e.Re bokelletse boiphihlelo bo bongata tlhahisong ea li-antenna tse nang le li-multi-layer, tse nang le maqhubu a phahameng, liboto tse lebelo le holimo, li-module tsa optical, koporo e teteaneng, li-block tsa koporo tse patiloeng, li-drill tse ka morao, liboto tse ka morao, joalo-joalo. le taolo ea impedance, hape li na le bokhoni ba ho itlhahloba ka boits'oaro.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Sebopeho sa lihlahisoa

-Palo e phahameng ea lera ho fihla ho Layers tse 40 (Zhuhai 2023)

● -5G Antenna

● -SI Taolo

● -TDR/VNA

Litšebeletso tsa Rōna

Litšebeletso tsa tlhahiso ea elektronike tsa PCB le PCBA

Ts'ebeletso ea tlhahiso ea 1.PCB e Hloka faele ea Gerber(CAM350 RS274X), lifaele tsa PCB(Protel 99,AD, Eagle), joalo-joalo.

2.Litšebeletso tsa ho fumana likarolo tsa BOM Lethathamo le kenyelletsa nomoro ea Karolo e qaqileng le Moqapi

Litšebeletso tsa kopano ea 3.PCB Lifaele tse ka holimo le Lifaele tsa Khetha le ho Beha, pokello ea kopano

4.Programming & Testing Services Program,taelo le mokhoa oa teko joalo-joalo.

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PCBA botekgeniki bokgoni

SMT Ho nepahala ha boemo:20 um
Boholo ba likarolo: 0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP
Max.karolo bophahamo::25mm
Max.PCB boholo: 680×500mm
Min.PCB boholo: ha ho na moeli
Botenya ba PCB: 0.3 ho 6mm
Boima ba PCB: 3KG
Leqhubu-Solder Max.PCB bophara: 450mm
Min.PCB bophara: ha ho na moeli
Bophahamo ba karolo: Top 120mm/Bot 15mm
Mofufutso-Solder Mofuta oa tšepe: karolo, kaofela, inlay, sidestep
Lintho tse entsoeng ka tšepe: Koporo, Aluminium
Qetello ea Bokaholimo: Plating Au, plating sliver, plating Sn
Sekhahla sa senya sa moea: ka tlase ho 20%
Tobetsa-lokela Sebaka sa khatiso: 0-50KN
Max.PCB boholo: 800X600mm
Teko ICT, Probe flying, cha-in, teko ea mosebetsi, ho palama baesekele

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  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona