E mong setopong elektronike optoelectronic PCBA boto moetsi
Sebopeho sa lihlahisoa
● -Multilayer koporo e boima
● -6oz UL e amohelehile ka botenya ba koporo
● -Ho kenya chelete ea tšepe ea koporo
● -Moqapi oa li-coil
● -Inductance teko
● -Hi-Pot teko
● -Teko ea bokhoni
● -DCR teko
Mefuta le Lisebelisoa
1. (A) 4-layer boto lintho tse bonahalang ke haholo-holo epoxy resin khalase fber lesela.Lisebelisoa tsa mantlha ke likhomphutha tsa hau, tsa bongaka !lisebelisoa tsa elektroniki, lisebelisoa tsa ho lekanya, mechini ea tlhahlobo ea semiconductor, mechini ea taolo ea lipalo, li-switch tsa elektroniki, mechini ea puisano, liboto tsa potoloho ea memori, likarete tsa IC, jj.
2. (B) 6-8 lera boto substrate lintho tse bonahalang e ntse e haholo-holo epoxy resin khalase fber lesela.Bongata ba tsona li sebelisoa ho li-switch tsa elektroniki, litekong tsa semiconductor, likhomphutha tsa batho ba mahareng, litsi tsa mosebetsi tsa boenjiniere le mechini e meng.
3. (C) lisebelisoa tsa boto ea 10-layer ka holim'a thepa haholo-holo ke lintho tse entsoeng ka khalase ea benzene kapa resin ea epoxy e le lisebelisoa tse ngata tsa PCB tsa substrate.Tšebeliso ea mofuta ona oa PCB e khethehile haholoanyane, e sebelisoang lik'homphieutheng tse kholo tsa indasteri, lik'homphieutha tse lebelo, mechine ea tšireletso, mechine ea puisano, joalo-joalo.
Bokhoni ba Boenjiniere ba PCB
| SMT | Ho nepahala ha boemo:20 um |
| Boholo ba likarolo: 0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max.karolo bophahamo::25mm | |
| Max.PCB boholo: 680×500mm | |
| Min.PCB boholo: ha ho na moeli | |
| Botenya ba PCB: 0.3 ho 6mm | |
| Boima ba PCB: 3KG | |
| Leqhubu-Solder | Max.PCB bophara: 450mm |
| Min.PCB bophara: ha ho na moeli | |
| Bophahamo ba karolo: Top 120mm/Bot 15mm | |
| Mofufutso-Solder | Mofuta oa tšepe: karolo, kaofela, inlay, sidestep |
| Lintho tse entsoeng ka tšepe: Koporo, Aluminium | |
| Qetello ea Bokaholimo: Plating Au, plating sliver, plating Sn | |
| Sekhahla sa senya sa moea: ka tlase ho 20% | |
| Tobetsa-lokela | Sebaka sa khatiso: 0-50KN |
| Max.PCB boholo: 800X600mm | |
| Teko | ICT, Probe flying, cha-in, teko ea mosebetsi, ho palama baesekele |
LBH
Ha e le hantle HA HO MOQ Bakeng sa Lihlahisoa tse ngata, Trail Oeder Kapa Sample Order e Tla Amoheloa.
Boholo ba Lihlahisoa tsa rona li na le Warranty ea Boleng ea Likhoeli tse 6.
Letšoao le Ikhethetsoeng Bakeng sa Lihlahisoa Kapa Sephutheloana se Tla Amoheloa Haholo.Re Entse Tse ngata Bakeng sa Bareki ba Rona.
Pls Tiisa le Rona Modle eo U e Hlokang.Mme Tefiso ea Mohlala e Tla Buseletsoa ka Bongata.
Mohlala o tla romelloa nakong ea matsatsi a 2 kamora ho fumana tefo.
Ka tloaelo ho nka matsatsi a 5 a ho sebetsa kamora ho fumana tefo.
100% QC Pele ho Thomello.Haeba ho na le Bothata bo Neng bo sa Lebelloa Happan, Joalo ka Bothata ba Boleng
