E mong setopong elektronike Security PCBA boto moetsi
Sebopeho sa lihlahisoa
● Boitsebiso: Fr-4
● Palo ea Lera: Mekhahlelo e 6
● Botenya ba PCB: 1.2mm
● Min.Trace / Space Outer: 0.102mm/0.1mm
● Min.Sekoti se phuntsoeng: 0.1mm
● Ka Mokhoa: Ho Tenta ka Litente
● Surface Finish: ENIG
Molemo
1) Lilemo tsa boiphihlelo tlhahisong ea halofo ea lesoba, ho sebelisa mochini oa Da Chuan Routing, ho tsamaisa halofo ea lesoba ebe o tsamaisa sebopeho, ho fihlela litlhoko tse thata tsa sebopeho;
2) Bonyane bophara ba mela le sebaka sa mela: 0.065/0.065mm, bonyane BGA pad: 0.2mm, kopana le litlhoko tse khethehileng tsa moreki;
3) Electroplated Copper Flling of Blind Holes by Universal DVCP(Double Track Vertical Continuous Copper Plating Equip ment) ho netefatsa hore ha ho na likheo mekoting le boleng ba lihlahisoa tsa bareki;
4) Mokhoa o tiileng oa tlhahlobo ea sampole, netefatsa tlhahiso ea lihlahisoa tsa bareki.
PCBA botekgeniki bokgoni
| SMT | Ho nepahala ha boemo:20 um |
| Boholo ba likarolo: 0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max.karolo bophahamo::25mm | |
| Max.PCB boholo: 680×500mm | |
| Min.PCB boholo: ha ho na moeli | |
| Botenya ba PCB: 0.3 ho 6mm | |
| Boima ba PCB: 3KG | |
| Leqhubu-Solder | Max.PCB bophara: 450mm |
| Min.PCB bophara: ha ho na moeli | |
| Bophahamo ba karolo: Top 120mm/Bot 15mm | |
| Mofufutso-Solder | Mofuta oa tšepe: karolo, kaofela, inlay, sidestep |
| Lintho tse entsoeng ka tšepe: Koporo, Aluminium | |
| Qetello ea Bokaholimo: Plating Au, plating sliver, plating Sn | |
| Sekhahla sa senya sa moea: ka tlase ho 20% | |
| Tobetsa-lokela | Sebaka sa khatiso: 0-50KN |
| Max.PCB boholo: 800X600mm | |
| Teko | ICT, Probe flying, cha-in, teko ea mosebetsi, ho palama baesekele |
