Vehicle Electronics PCBA board

Tšebeletso ea rona:

PCB ea likoloi e etsa hore e bokelle boiphihlelo bo bongata lits'ebetsong tsa taolo ea tlhahiso le mahlale. Tlhahiso ea rona ea lihlahisoa tsa likoloi e fapane haholo ka mekhahlelo e kang koporo e boima, HDI, High-frequency le High-speed. Tsena li sebelisetsoa ho hlahisa motsamao o hokahantsoeng, motsamao o ikemetseng le motsamao o ntseng o eketseha oa motlakase

Tlhokahalo ea theknoloji ea nako e telele ea bophelo, mojaro o phahameng oa mocheso le moralo o monyane oa sekontiri o ka fihlelleha ka botlalo. Re na le ts'ebelisano ea maano le barekisi ba ka sehloohong ho nts'etsapele le ho kenya ts'ebetsong lisebelisoa tse ncha, lisebelisoa le nts'etsopele ea ts'ebetso bakeng sa theknoloji ea hajoale le ea nakong e tlang ea likoloi.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Sebopeho sa lihlahisoa

● -Teko ea ho tšepahala

● -Traceability

● -Tsamaiso ea mocheso

● -Koporo e boima ≥ 105um

● -HDI

● -Semi - flex

● -E thata - e tenyetseha

● -Mohaho oa microwave o phahameng oa maqhubu

Litšobotsi tsa sebopeho sa PCB

1. Dielectric layer (Dielectric): E sebelisetsoa ho boloka ho pata pakeng tsa mela le lihlopha, tse tsejoang e le substrate.

2. Silkscreen (Legend/Marking/Silkscreen): Ena ke karolo e seng ya bohlokwa. Mosebetsi oa eona o ka sehloohong ke ho tšoaea lebitso le lebokose la boemo ba karolo e 'ngoe le e' ngoe holim'a boto ea potoloho, e loketseng bakeng sa tlhokomelo le ho tsebahatsa ka mor'a kopano.

3.Surface treatment (SurtaceFinish): Kaha bokaholimo ba koporo bo na le oxidized habonolo tikolohong e tloaelehileng, e ke ke ea kenngoa ka tinned (solderability e futsanehileng), kahoo bokaholimo ba koporo bo tla sireletsoa bo tla sireletsoa. Mekhoa ea ts'ireletso e kenyelletsa HASL, ENIG, Immersion Silver, Immersion TIn, le organic solder preservative (OSP). Mokhoa o mong le o mong o na le melemo le mefokolo ea oona, ka kakaretso o bitsoa phekolo ea holim'a metsi.

SVSV (1)
SVSV (2)

Bokhoni ba Boenjiniere ba PCB

Mekhahlelo Tlhahiso e kholo: 2 ~ 58 layers / Pilot run: 64 layers
Max. Botenya Tlhahiso e kholo: 394mil (10mm) / Pilot run: 17.5mm
Lintho tse bonahalang FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic e tlatsitsoeng, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, joalo-joalo.
Min. Bophara/ Sebaka Lera le ka hare: 3mil/3mil (HOZ), Lera ka ntle: 4mil/4mil(1OZ)
Max. Botenya ba Koporo Setifikeiti sa UL: 6.0 OZ / Pilot run: 12OZ
Min. Boholo ba lesoba Boro ea mochini: 8mil(0.2mm) Laser ea cheka: 3mil(0.075mm)
Max. Boholo ba Panel 1150mm × 560mm
Aspect ratio 18:1
Surface Finish HASL,Khauta e qoelisoang, Tin ea ho qoelisoa, OSP, ENIG + OSP, Silivera e qoelisoang, ENEPIG, Monoana oa Khauta
Mokhoa o Khethehileng Lesoba le Epetsoeng, Lesoba le Foufetseng, Khanyetso e Kenyelelitsoeng, Bokhoni bo Kenyellelitsoeng, Hybrid, Lebasetere la Karolo, Sekhahla se phahameng sa sekhahla, Ho cheka ka morao, le Resistance control

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona