Vehicle Electronics PCBA board

Tšebeletso ea rona:

PCB ea likoloi e etsa hore e bokelle boiphihlelo bo bongata lits'ebetsong tsa taolo ea tlhahiso le mahlale.Tlhahiso ea rona ea lihlahisoa tsa likoloi e fapane haholo ka mekhahlelo e kang koporo e boima, HDI, High-frequency le High-speed.Tsena li sebelisetsoa ho hlahisa motsamao o hokahantsoeng, motsamao o ikemetseng le motsamao o ntseng o eketseha oa motlakase

Tlhokahalo ea theknoloji ea nako e telele ea bophelo, mojaro o phahameng oa mocheso le moralo o monyane oa sekontiri o ka fihlelleha ka botlalo.Re na le ts'ebelisano ea maano le barekisi ba ka sehloohong ho nts'etsapele le ho kenya ts'ebetsong lisebelisoa tse ncha, lisebelisoa le nts'etsopele ea ts'ebetso bakeng sa mahlale a hajoale le a nakong e tlang a likoloi.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Sebopeho sa lihlahisoa

● -Teko ea ho tšepahala

● -Traceability

● -Tsamaiso ea mocheso

● -Koporo e boima ≥ 105um

● -HDI

● -Semi - flex

● -E thata - e tenyetseha

● -Mohaho oa microwave o phahameng oa maqhubu

Litšobotsi tsa sebopeho sa PCB

1. Dielectric layer (Dielectric): E sebelisetsoa ho boloka ho pata pakeng tsa mela le lihlopha, tse tsejoang e le substrate.

2. Silkscreen (Legend/Marking/Silkscreen): Ena ke karolo e seng ya bohlokwa.Mosebetsi oa eona o ka sehloohong ke ho tšoaea lebitso le lebokose la boemo ba karolo e 'ngoe le e' ngoe holim'a boto ea potoloho, e loketseng bakeng sa tlhokomelo le boitsebiso ka mor'a kopano.

3.Surface treatment (SurtaceFinish): Kaha bokaholimo ba koporo bo na le oxidized habonolo tikolohong e tloaelehileng, e ke ke ea kenngoa ka tinned (mafutsana solderability), kahoo bokaholimo ba koporo bo tla sireletsoa.Mekhoa ea ts'ireletso e kenyelletsa HASL, ENIG, Immersion Silver, Immersion TIn, le organic solder preservative (OSP).Mokhoa o mong le o mong o na le melemo le mefokolo ea oona, ka kakaretso o bitsoa phekolo ea holim'a metsi.

SVSV (1)
SVSV (2)

Bokhoni ba Boenjiniere ba PCB

Mekhahlelo Tlhahiso e kholo: 2 ~ 58 layers / Pilot run: 64 layers
Max.Botenya Tlhahiso e kholo: 394mil (10mm) / Pilot run: 17.5mm
Lintho tse bonahalang FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic e tlatsitsoeng, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, joalo-joalo.
Min.Bophara/ Sebaka Lera le ka hare: 3mil/3mil (HOZ), Lera ka ntle: 4mil/4mil(1OZ)
Max.Botenya ba Koporo Setifikeiti sa UL: 6.0 OZ / Pilot run: 12OZ
Min.Boholo ba lesoba Boro ea mochini: 8mil(0.2mm) Laser ea cheka: 3mil(0.075mm)
Max.Boholo ba Panel 1150mm × 560mm
Aspect ratio 18:1
Surface Finish HASL,Khauta e qoelisoang, Tin ea ho qoelisoa, OSP, ENIG + OSP, Silivera e qoelisoang, ENEPIG, Monoana oa Khauta
Mokhoa o Khethehileng Lesoba le Epetsoeng, Sekoti se Foufetseng, Khanyetso e Kenyelelitsoeng, Bokhoni bo Kenyelelitsoeng, Hybrid, Lebasetere la Karolo, Boima bo phahameng bo sa Lekaneng, Ho cheka ka morao, le Resistance control.

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona