E mong setopong elektronike Server PCBA boto moetsi

E mong setopong elektroniki Server PCBA boto moetsi Featured Image

Tšebeletso ea rona:

Ka nts'etsopele ea data e kholo, cloud computing le puisano ea 5G, ho na le monyetla o moholo ho indasteri ea seva / polokelo.Li-server li hlahisoa ka bokhoni ba komporo ea CPU e potlakileng, ts'ebetso e ts'eptjoang ea nako e telele, bokhoni bo matla ba ho sebetsana le data ea I / O le katoloso e ntle.Suntak Technology e ikemiselitse ho fana ka mapolanka a lebelo le phahameng le mapolanka a mangata a mangata a nang le ts'epo e phahameng, botsitso bo phahameng le bokhoni bo phahameng ba ho mamella liphoso bo hlokahalang bakeng sa boleng ba seva.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Sebopeho sa lihlahisoa

● Boitsebiso: Fr-4

● Palo ea Lera: Mekhahlelo e 6

● Botenya ba PCB: 1.2mm

● Min.Trace / Space Outer: 0.102mm/0.1mm

● Min.Sekoti se phuntsoeng: 0.1mm

● Ka Mokhoa: Ho Tenta ka Litente

● Surface Finish: ENIG

Litšobotsi tsa sebopeho sa PCB

1. Potoloho le mohlala (Pattern): Potoloho e sebelisoa e le sesebelisoa sa ho tsamaisa pakeng tsa likarolo.Ka moralo, sebaka se seholo sa koporo se tla etsoa e le sebaka sa motheo le sa phepelo ea matla.Mela le litšoantšo li etsoa ka nako e le 'ngoe.

2. Hole (Throughole/via): Mokoti oa ho feta o ka etsa hore mela ea maemo a fetang a mabeli a tsamaisane, e kholoanyane ka lesoba e sebelisoa e le plug-in, 'me lesoba le non-conductive (nPTH) hangata le sebelisoa. joalo ka bokaholimo Ho phahamisa le ho beha maemo, e sebelisetsoang ho lokisa li-screw nakong ea kopano.

3. Solderresistant inki (Solderresistant/SolderMask): Ha se libaka tsohle tsa koporo tse lokelang ho ja likaroloana tsa thini, kahoo sebaka se sa jeoang se tla hatisoa ka lera la thepa (hangata epoxy resin) e arolang bokaholimo ba koporo ho tloha ho jeleng thini ho ea ho. qoba ho se solder.Ho na le potoloho e khuts'oane lipakeng tsa mela e entsoeng ka makotikoti.Ho ea ka mekhoa e fapaneng, e arotsoe ka oli e tala, oli e khubelu le oli e putsoa.

4. Dielectric layer (Dielectric): E sebelisetsoa ho boloka ho pata pakeng tsa mela le lihlopha, tse tsejoang e le substrate.

PCBA botekgeniki bokgoni

SMT	Ho nepahala ha boemo:20 um
	Boholo ba likarolo: 0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP
	Max.karolo bophahamo::25mm
	Max.PCB boholo: 680×500mm
	Min.PCB boholo: ha ho na moeli
	Botenya ba PCB: 0.3 ho 6mm
	Boima ba PCB: 3KG
Leqhubu-Solder	Max.PCB bophara: 450mm
	Min.PCB bophara: ha ho na moeli
	Bophahamo ba karolo: Top 120mm/Bot 15mm
Mofufutso-Solder	Mofuta oa tšepe: karolo, kaofela, inlay, sidestep
	Lintho tse entsoeng ka tšepe: Koporo, Aluminium
	Qetello ea Bokaholimo: Plating Au, plating sliver, plating Sn
	Sekhahla sa senya sa moea: ka tlase ho 20%
Tobetsa-lokela	Sebaka sa khatiso: 0-50KN
Tobetsa-lokela	Max.PCB boholo: 800X600mm
Teko	ICT, Probe flying, cha-in, teko ea mosebetsi, ho palama baesekele