E mong setopong elektronike Server PCBA boto moetsi
Sebopeho sa lihlahisoa
● Boitsebiso: Fr-4
● Palo ea Lera: Mekhahlelo e 6
● Botenya ba PCB: 1.2mm
● Min. Trace / Space Outer: 0.102mm/0.1mm
● Min. Sekoti se phuntsoeng: 0.1mm
● Ka Mokhoa: Ho Tenta ka Litente
● Surface Finish: ENIG
Litšobotsi tsa sebopeho sa PCB
1. Potoloho le mohlala (Pattern): Potoloho e sebelisoa e le sesebelisoa sa ho tsamaisa pakeng tsa likarolo. Ka moralo, sebaka se seholo sa koporo se tla etsoa e le sebaka sa motheo le sa phepelo ea matla. Mela le litšoantšo li etsoa ka nako e le 'ngoe.
2. Hole (Throughole/via): Mokoti oa ho feta o ka etsa hore mela ea mekhahlelo e fetang e 'meli e tsamaisane, e kholoanyane ka lesoba e sebelisoa e le plug-in, 'me lesoba le non-conductive (nPTH) hangata le sebelisoa. joalo ka bokaholimo Ho phahamisa le ho beha maemo, e sebelisetsoang ho lokisa li-screw nakong ea kopano.
3. Solderresistant inki (Solderresistant/SolderMask): Ha se libaka tsohle tsa koporo tse lokelang ho ja likaroloana tsa thini, kahoo sebaka se sa jeoang se tla hatisoa ka lera la thepa (hangata epoxy resin) e arolang bokaholimo ba koporo ho tloha thining qoba ho se solder. Ho na le potoloho e khuts'oane lipakeng tsa mela e entsoeng ka makotikoti. Ho ea ka mekhoa e fapaneng, e arotsoe ka oli e tala, oli e khubelu le oli e putsoa.
4. Dielectric layer (Dielectric): E sebelisetsoa ho boloka ho pata pakeng tsa mela le lihlopha, tse tsejoang e le substrate.
PCBA botekgeniki bokgoni
| SMT | Ho nepahala ha boemo:20 um |
| Boholo ba likarolo: 0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. karolo bophahamo::25mm | |
| Max. PCB boholo: 680×500mm | |
| Min. PCB boholo: ha ho na moeli | |
| Botenya ba PCB: 0.3 ho 6mm | |
| Boima ba PCB: 3KG | |
| Leqhubu-Solder | Max. PCB bophara: 450mm |
| Min. PCB bophara: ha ho na moeli | |
| Bophahamo ba karolo: Top 120mm/Bot 15mm | |
| Mofufutso-Solder | Mofuta oa tšepe: karolo, kaofela, inlay, sidestep |
| Lintho tse entsoeng ka tšepe: Koporo, Aluminium | |
| Qetello ea Bokaholimo: Plating Au, plating sliver, plating Sn | |
| Sekhahla sa senya sa moea: ka tlase ho 20% | |
| Tobetsa-lokela | Sebaka sa khatiso: 0-50KN |
| Max. PCB boholo: 800X600mm | |
| Teko | ICT, Probe flying, cha-in, teko ea mosebetsi, ho palama baesekele |
