PCB SMT Electronic Poker Machine Circuit PCB Board PCB Assembly
Litšebeletso tsa Rōna
| Litšebeletso tsa Rōna | Litšebeletso tsa tlhahiso ea elektronike tsa PCB le PCBA |
| 1.PCB tlhahiso ea tšebeletso | U hloka faele ea Gerber(CAM350 RS274X), lifaele tsa PCB(Protel 99, AD, Eagle), joalo-joalo |
| 2. Litšebeletso tsa ho fumana lisebelisoa | Lethathamo la BOM le kenyelelitse nomoro ea Karolo e qaqileng le Moqapi |
| 3.PCB kopano ditshebeletso | Lifaele tse ka holimo le lifaele tsa Khetha le ho Beha, setšoantšo sa kopano |
| 4.Programming & Testing services | Lenaneo, taeo le mokhoa oa tlhahlobo jj. |
| 5.Litšebeletso tsa kopano ea matlo | Lifaele tsa 3D, mohato kapa tse ling |
| Litšebeletso tsa 6.Reverse boenjiniere | Mehlala le tse ling |
| Litšebeletso tsa kopano ea 7.Cable & terata | Tlhaloso le tse ling |
| 8.Litšebeletso tse ling | Litšebeletso tsa tlatsetso ea boleng |
Bokhoni ba Boenjiniere ba PCB
| Mekhahlelo | Tlhahiso e kholo: 2 ~ 58 layers / Pilot run: 64 layers |
| Max. Botenya | Tlhahiso e kholo: 394mil (10mm) / Pilot run: 17.5mm |
| Lintho tse bonahalang | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic e tlatsitsoeng, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, joalo-joalo. |
| Min. Bophara/ Sebaka | Lera le ka hare: 3mil/3mil (HOZ), Lera ka ntle: 4mil/4mil(1OZ) |
| Max. Botenya ba Koporo | Setifikeiti sa UL: 6.0 OZ / Pilot run: 12OZ |
| Min. Boholo ba lesoba | Boro ea mochini: 8mil(0.2mm) Laser ea cheka: 3mil(0.075mm) |
| Max. Boholo ba Panel | 1150mm × 560mm |
| Aspect ratio | 18:1 |
| Surface Finish | HASL,Khauta e qoelisoang, Tin ea ho qoelisoa, OSP, ENIG + OSP, Silivera e qoelisoang, ENEPIG, Monoana oa Khauta |
| Mokhoa o Khethehileng | Lesoba le Epetsoeng, Lesoba le Foufetseng, Khanyetso e Kenyelelitsoeng, Bokhoni bo Kenyellelitsoeng, Hybrid, Lebasetere la Karolo, Sekhahla se phahameng sa sekhahla, Ho cheka ka morao, le Resistance control |
PCBA botekgeniki bokgoni
| SMT | Ho nepahala ha boemo:20 um |
| Boholo ba likarolo: 0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. karolo bophahamo::25mm | |
| Max. PCB boholo: 680×500mm | |
| Min. PCB boholo: ha ho na moeli | |
| Botenya ba PCB: 0.3 ho 6mm | |
| Boima ba PCB: 3KG | |
| Leqhubu-Solder | Max. PCB bophara: 450mm |
| Min. PCB bophara: ha ho na moeli | |
| Bophahamo ba karolo: Top 120mm/Bot 15mm | |
| Mofufutso-Solder | Mofuta oa tšepe: karolo, kaofela, inlay, sidestep |
| Lintho tse entsoeng ka tšepe: Koporo, Aluminium | |
| Qetello ea Bokaholimo: Plating Au, plating sliver, plating Sn | |
| Sekhahla sa senya sa moea: ka tlase ho 20% | |
| Tobetsa-lokela | Sebaka sa khatiso: 0-50KN |
| Max. PCB boholo: 800X600mm | |
| Teko | ICT, Probe flying, cha-in, teko ea mosebetsi, ho palama baesekele |
LBH
MOQ ke eng?
Ha e le hantle HA HO MOQ Bakeng sa Lihlahisoa tse ngata, Trail Oeder Kapa Sample Order e Tla Amoheloa
Tiisetso ya Boleng?
Boholo ba Lihlahisoa tsa rona li na le Warranty ea Boleng ea Likhoeli tse 6
Na re Lokela ho Sebelisa LOGO / Brand ea Rōna?
Letšoao le ikhethileng bakeng sa lihlahisoa kapa sephutheloana le tla amoheloa haholo.
Re Entse Tse ngata Bakeng sa Bareki ba Rona Mohlala?
Pls Tiisa le Rona Modle eo U e Hlokang.Mme Tefiso ea Mohlala e Tla Buseletsoa ka Bongata.
Mohlala o tla romelloa nakong ea matsatsi a 2 ka mor'a ho fumana nako ea pele ea tefo?
Ka tloaelo ho nka matsatsi a 5 a ho sebetsa kamora ho fumana tefo.
Litšebeletso tsa Ka mor'a Thekiso?
100% QC Pele ho Thomello.Haeba ho na le Bothata bo sa Lebelloang Hoa etsahala, Joalo ka Bothata ba Boleng
