Electronic server PCBA boto moetsi
Sebopeho sa lihlahisoa
● Boitsebiso: Fr-4
● Palo ea Lera: Mekhahlelo e 6
● Botenya ba PCB: 1.2mm
● Min.Trace / Space Outer: 0.102mm/0.1mm
● Min.Sekoti se phuntsoeng: 0.1mm
● Ka Mokhoa: Ho Tenta ka Litente
● Surface Finish: ENIG
Litšobotsi tsa sebopeho sa PCB
1. Potoloho le mohlala (Pattern): Potoloho e sebelisoa e le sesebelisoa sa ho tsamaisa pakeng tsa likarolo.Ka moralo, sebaka se seholo sa koporo se tla etsoa e le sebaka sa motheo le sa phepelo ea matla.Mela le litšoantšo li etsoa ka nako e le 'ngoe.
2. Hole (Throughole/via): Mokoti oa ho feta o ka etsa hore mela ea maemo a fetang a mabeli a tsamaisane, e kholoanyane ka lesoba e sebelisoa e le plug-in, 'me lesoba le non-conductive (nPTH) hangata le sebelisoa. joalo ka bokaholimo Ho phahamisa le ho beha maemo, e sebelisetsoang ho lokisa li-screw nakong ea kopano.
3. Solderresistant inki (Solderresistant/SolderMask): Ha se libaka tsohle tsa koporo tse lokelang ho ja likaroloana tsa thini, kahoo sebaka se sa jeoang se tla hatisoa ka lera la thepa (hangata epoxy resin) e arolang bokaholimo ba koporo ho tloha ho jeleng thini ho ea ho. qoba ho se solder.Ho na le potoloho e khuts'oane lipakeng tsa mela e entsoeng ka makotikoti.Ho ea ka mekhoa e fapaneng, e arotsoe ka oli e tala, oli e khubelu le oli e putsoa.
4. Dielectric layer (Dielectric): E sebelisetsoa ho boloka ho pata pakeng tsa mela le lihlopha, tse tsejoang e le substrate.
PCBA botekgeniki bokgoni
SMT | Ho nepahala ha boemo:20 um |
Boholo ba likarolo: 0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max.karolo bophahamo::25mm | |
Max.PCB boholo: 680×500mm | |
Min.PCB boholo: ha ho na moeli | |
Botenya ba PCB: 0.3 ho 6mm | |
Boima ba PCB: 3KG | |
Leqhubu-Solder | Max.PCB bophara: 450mm |
Min.PCB bophara: ha ho na moeli | |
Bophahamo ba karolo: Top 120mm/Bot 15mm | |
Mofufutso-Solder | Mofuta oa tšepe: karolo, kaofela, inlay, sidestep |
Lintho tse entsoeng ka tšepe: Koporo, Aluminium | |
Qetello ea Bokaholimo: Plating Au, plating sliver, plating Sn | |
Sekhahla sa senya sa moea: ka tlase ho 20% | |
Tobetsa-lokela | Sebaka sa khatiso: 0-50KN |
Max.PCB boholo: 800X600mm | |
Teko | ICT, Probe flying, cha-in, teko ea mosebetsi, ho palama baesekele |
Ka tsoelo-pele e potlakileng ea thekenoloji le tlhokahalo e ntseng e eketseha ea ts'ebetso ea data e potlakileng, indasteri ea seva / polokelo e ntse e eketseha ka tsela e tsotehang.Ho na le tlhokahalo e ntseng e eketseha ea li-server tse nang le matla a khomphutha ea CPU ea lebelo le holimo, ts'ebetso e tšepahalang, ts'ebetso e ntle ea data ea kantle, le scalability e ntle haholo.Nakong ena ea data e kholo, komporo ea maru le puisano ea 5G, re moetsi oa boto ea komporo e le 'ngoe ea PCBA ho fihlela litlhoko tsena tse ntseng li hola.
Re tsebahala ka boitelo ba rona ba ho fana ka liboto tsa li-server tsa boleng bo holimo, tse sebetsang hantle.Liboto tsa rona tsa bo-mme li etselitsoe ho ntlafatsa matla a CPU, ho netefatsa komporo e se nang moeli le e potlakileng.Re utloisisa bohlokoa ba ts'ebetso e tšepahalang ea nako e telele indastering ea li-server, ke ka lebaka leo liboto tsa rona li lekoang ka thata le liprothokholo tsa netefatso ea boleng ho netefatsa ts'ebetso e nepahetseng le ho tšoarella.
E 'ngoe ea likarolo tse hlokomelehang tsa liboto tsa rona tsa li-server ke bokhoni ba bona bo matla ba ho sebetsana le data ba I/O.Re utloisisa karolo ea bohlokoa eo data e e bapalang tikolohong ea kajeno ea dijithale, 'me liboto tsa rona li etselitsoe ho sebetsana le lintlha tse ngata ka katleho e ke keng ea lekanngoa.Ebang ke polokelo ea data, phetiso ea data kapa ts'ebetso ea data, liboto tsa rona tsa bo-mme li fana ka likarolo tse holimo ho fihlela litlhoko tse ntseng li hola tsa li-server tsa sejoale-joale.
Ho feta moo, liboto tsa rona tsa li-server li entsoe ka kelello e betere.Re hlokomela tlhokahalo ea ho feto-fetoha le maemo le scalability tsamaisong ea li-server bakeng sa likhoebo le mekhatlo.Liboto tsa rona tsa bo-'mè li na le theknoloji e tsoetseng pele 'me li ka kopanya likarolo tse ling le li-module habonolo.Sena se tiisa hore bareki ba rona ba khona ho holisa bokhoni ba seva sa bona ka mokhoa o se nang moeli ha litlhoko tsa bona li ntse li hola ntle le ho senya ts'ebetso kapa ts'epahalo.
Re motlotlo ka ho tšepahala ho phahameng, botsitso le mamello ea liphoso.Rea tseba hore litsamaiso tsa seva hangata li sebetsa tlas'a meroalo e boima ea mosebetsi le maemo a thata.Ke ka lebaka leo mapolanka a rona a entsoeng ka thepa e matla 'me a khomarela litekanyetso tse tiileng tsa boleng, ho fana ka botšepehi le botsitso bo phahameng esita le libakeng tse thata ka ho fetisisa.Ka moralo oa rona o mamellang liphoso, haeba ho ka hlaha mathata a sa lebelloang, liboto tsa rona li entsoe ho netefatsa ts'ebetso e sa sitisoeng le ho fokotsa nako.
Ka kakaretso, re fetohile khetho ea pele bakeng sa likhoebo le mekhatlo e batlang liboto tsa li-server tsa lebelo le holimo, tse tšepahalang le tse tenyetsehang.Re ikemiselitse ho etsa bokhabane le khotsofalo ea bareki, re ikitlaelletsa ho fana ka lihlahisoa tsa maemo a holimo tse nolofalletsang bareki ba rona ho hlokomela bokhoni bo felletseng ba litsamaiso tsa sejoale-joale tsa seva.Selekane le rona ho fumana maemo a macha a ts'ebetso ea seva le ho nka monyetla ka menyetla e makatsang e hlahisoang ke data e kholo, komporo ea maru le likhokahano tsa 5G.